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  • Position:

    Equipment Engineer

    Occupation:

    Engineering

    Sub Occupation:

    Maintenance

  • Position:

    Service

    Occupation:

    Customer Service/CRM/Call Center

    Sub Occupation:

    Service Advisor

Interested business type

  • Electronic Industry

Job Location

Bangkok (All)

Latest Salary

30,000 - 40,000 THB

Job Type

Full time

Availability

within 15 days

Working Bangkok

Yes

Work Upcountry

Yes

Willing to work oversea?

Yes

Education

2009 - King Mongkut's University of Technology North Bangkok

Faculty:Industrial Technology
Major:Telecommunication Technology
GPA 2.98 - Bachelor's Degree

1998 - King Mongkut's University of Technology North Bangkok

Faculty:Industrial Technology
Major:Electronics
GPA 2.18 - High Vocational

Experience/ Internship

March 2022 toJanuary 2025  (2 Year 11 Month)
  • Last Position:
  • Leader maintenance engineer

Job Description

  • Equipment Wafer processing (Back grinding/ Inline mounting, Laser marking, Laser grooving, Wafer Dicing, Laser Stealth Dicing, Manual vacuum laminator, Die sorter, AOI) machine and Front end operation line (FOL) Die Bonder and Wire bonder machine - KPI: Machine Performance, Overall Equipment Effectiveness, Capability Machine utilization - Preventive Maintenance Plan - Create maintenance systematics for beginning machine come in production line, assume; machine register into IE, preventive maintenance schedule plan, Calibration, spare parts stocking, down time and setup/ conversion machine monitoring. - Provided strong leadership and technical expertise to maintain and continuously improve existing procedures - Solved maintenance problems - Recommended measures to improve the conditions and operation of machines and Equipment - Recorded orders for tracking, spare parts and maintenance history of equipment and computer system - Designed manuals and documented to simplify the job for future maintenance. - Repaired / replaced equipment to ensure proper operation. - Oriented and guided maintenance and repair - Oversaw the maintenance personnel and conducted opinion performances and technical staff - Used a variety of techniques and guidelines to ensure a safe environment around the plant and space. Said that all workers maintain and follow safety rules and guidelines prescribed
July 2016 toMarch 2022  (5 Year 9 Month)
  • Last Position:
  • Senior Engineer

Job Description

  • Equipment Pre-Assembly (Backgrinding, Wafer Dicing, Laser Stealth Dicing) machine and Front end operation line (FOL) Die Bonder and Wire bonder machine - KPI: Machine Performance, Overall Equipment Effectiveness, Capability Machine utilization - Preventive Maintenance Plan - Provided strong leadership and technical expertise to maintain and continuously improve existing procedures - Solved maintenance problems - Recommended measures to improve the conditions and operation of machines and Equipment - Recorded orders for tracking, spare parts and maintenance history of equipment and computer system - Designed manuals and documented to simplify the job for future maintenance. - Repaired / replaced equipment to ensure proper operation. - Oriented and guided maintenance and repair - Oversaw the maintenance personnel and conducted opinion performances and technical staff - Used a variety of techniques and guidelines to ensure a safe environment around the plant and space. Said that all workers maintain and follow safety rules and guidelines prescribed - Process Backgrind process - Flow - Laminate backgrind tape before Backgrinding - Initial thickness 29, 25 mils - Initial thickness 15, 14 mils - Backgrinding wafer diameter 6, 8, 12 inch - Backgrinding wafer stack (double) which grind on top and bottom for support PRIMO 1D customer - Wafer saw process - Flow - Normal tape (non uv) which cure before saw - Normal tape (UV) which cure UV after saw - Pre-cut tape (DAF) - Method 2 types: Single and Step - Sawn Mems devices - Wafer backside coating - Flow - After wafer backgrind which adhesive screen-printing on wafer backside - Oven cure 2 types: Half and Full cure - Mounting dicing tape with film frame - Laser stealth dicing - Project Capacity and Cost saving - Backgrinding process - Wafer BG Polish Setup Time Elimination - Change wafer backside grind (Z2 fine mesh#2000) and polishing to poligrind (Z2 high mesh#8000) - Reduce UV high mercury lamp cost per unit to 50%
September 2012 toMarch 2016  (3 Year 6 Month)
  • Last Position:
  • Maintenance Engineer

Job Description

  • Problem solving on which has repetitive break down or uncontrollable in proper time frame/ target - Keep close contact / consult with local / abroad supplier to find specialist for problem - Improve MTTR and MTBF of machine / equipment - Recommend / revise planning for PM and check sheet of machine / equipment - Determine specification of machine's spare part/ equipment - Manage technician to support production 24 hrs - Develop / revise procedure for critical work and train to technician
September 2007 toJuly 2015  (7 Year 10 Month)
  • Last Position:
  • Technician

Job Description

  • Support Pre-Assembly Production line (Backgrinding, Wafer Dicing)
September 2004 toOctober 2006  (2 Year 1 Month)
  • Last Position:
  • Technician

Job Description

  • Repair/replace parts - Upgrade software new version - Test calling - Mobile phone: Nokia (a few), CODACOM C300/C400, Pentex, Smile.
August 2002 toMay 2004  (1 Year 9 Month)
  • Last Position:
  • Technician

Job Description

  • Support be Subcontract analyzer Department at ESSO (Thailand) Public Co., Ltd. - Service contract Pollution Control Department. - Service ambient monitor station.

Hard Skill

  •  - AutoCAD / Beginner
  •  - Potel / Beginner
  •  - Microsoft Office / Beginner
  •  - Microsoft Visio / Beginner
  •  - SPSS / Beginner
  •  - MATLAB / Beginner
  •  - LABVIEW / Beginner
  •  - Photoshop / Beginner
  •  - OrCaD / Beginner
  •  - Search engine utilization / Beginner

Soft Skill

  •  - Results Oriented
  •  - Communication skills
  •  - Enthusiastic
  •  - Interpersonal Skills
  •  - Leadership
  •  - Analytical Skills
  •  - High Responsibility
  •  - Ability to Work Under Pressure
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