Job Description

• Equipment Wafer processing (Back grinding/ Inline mounting, Laser marking, Laser grooving, Wafer Dicing, Laser Stealth Dicing, Manual vacuum laminator, Die sorter, AOI) machine and Front end operation line (FOL) Die Bonder and Wire bonder machine - KPI: Machine Performance, Overall Equipment Effectiveness, Capability Machine utilization - Preventive Maintenance Plan - Create maintenance systematics for beginning machine come in production line, assume; machine register into IE, preventive maintenance schedule plan, Calibration, spare parts stocking, down time and setup/ conversion machine monitoring. - Provided strong leadership and technical expertise to maintain and continuously improve existing procedures - Solved maintenance problems - Recommended measures to improve the conditions and operation of machines and Equipment - Recorded orders for tracking, spare parts and maintenance history of equipment and computer system - Designed manuals and documented to simplify the job for future maintenance. - Repaired / replaced equipment to ensure proper operation. - Oriented and guided maintenance and repair - Oversaw the maintenance personnel and conducted opinion performances and technical staff - Used a variety of techniques and guidelines to ensure a safe environment around the plant and space. Said that all workers maintain and follow safety rules and guidelines prescribed

Job Description

• Equipment Pre-Assembly (Backgrinding, Wafer Dicing, Laser Stealth Dicing) machine and Front end operation line (FOL) Die Bonder and Wire bonder machine - KPI: Machine Performance, Overall Equipment Effectiveness, Capability Machine utilization - Preventive Maintenance Plan - Provided strong leadership and technical expertise to maintain and continuously improve existing procedures - Solved maintenance problems - Recommended measures to improve the conditions and operation of machines and Equipment - Recorded orders for tracking, spare parts and maintenance history of equipment and computer system - Designed manuals and documented to simplify the job for future maintenance. - Repaired / replaced equipment to ensure proper operation. - Oriented and guided maintenance and repair - Oversaw the maintenance personnel and conducted opinion performances and technical staff - Used a variety of techniques and guidelines to ensure a safe environment around the plant and space. Said that all workers maintain and follow safety rules and guidelines prescribed - Process Backgrind process - Flow - Laminate backgrind tape before Backgrinding - Initial thickness 29, 25 mils - Initial thickness 15, 14 mils - Backgrinding wafer diameter 6, 8, 12 inch - Backgrinding wafer stack (double) which grind on top and bottom for support PRIMO 1D customer - Wafer saw process - Flow - Normal tape (non uv) which cure before saw - Normal tape (UV) which cure UV after saw - Pre-cut tape (DAF) - Method 2 types: Single and Step - Sawn Mems devices - Wafer backside coating - Flow - After wafer backgrind which adhesive screen-printing on wafer backside - Oven cure 2 types: Half and Full cure - Mounting dicing tape with film frame - Laser stealth dicing - Project Capacity and Cost saving - Backgrinding process - Wafer BG Polish Setup Time Elimination - Change wafer backside grind (Z2 fine mesh#2000) and polishing to poligrind (Z2 high mesh#8000) - Reduce UV high mercury lamp cost per unit to 50%

Job Description

• Problem solving on which has repetitive break down or uncontrollable in proper time frame/ target - Keep close contact / consult with local / abroad supplier to find specialist for problem - Improve MTTR and MTBF of machine / equipment - Recommend / revise planning for PM and check sheet of machine / equipment - Determine specification of machine's spare part/ equipment - Manage technician to support production 24 hrs - Develop / revise procedure for critical work and train to technician

Job Description

• Support Pre-Assembly Production line (Backgrinding, Wafer Dicing)

Job Description

• Repair/replace parts - Upgrade software new version - Test calling - Mobile phone: Nokia (a few), CODACOM C300/C400, Pentex, Smile.

Job Description

• Support be Subcontract analyzer Department at ESSO (Thailand) Public Co., Ltd. - Service contract Pollution Control Department. - Service ambient monitor station.